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Simultaneous Electrothermal Test Method for Pyroelectric Microsensors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Pyroelectric film materials, including polyvinylidene fluoride (PVDF) and its copolymers (e.g., P(VDF/trifluoroethylene)), are attractive candidates for low-cost infrared detection and imaging applications ...
Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Numerical simulations of time-dependent energy transport in semiconductor thin films are performed using the lattice Boltzmann method applied to phonon transport. The discrete lattice Boltzmann ...
Thermal Properties for Bulk Silicon Based on the Determination of Relaxation Times Using Molecular Dynamics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Molecular dynamics simulations are performed to estimate acoustical and optical phonon relaxation times, dispersion relations, group velocities, and specific heat of silicon needed to solve the ...
Hierarchical Modeling of Heat Transfer in Silicon-Based Electronic Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A hierarchical model of heat transfer for the thermal analysis of electronic devices is presented. The integration of participating scales (from nanoscale to macroscales) is achieved by (i) ...
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Integration of different functional components such as level two (L2) cache memory, high-speed I/O interfaces, and memory controller has enhanced microprocessor performance. In this architecture, ...